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| ZMD-Standard March 1998 Package SOP16 (150 mil) Dimensions in millimetres Based on IEC 191-2Q: Type 076E07S 1 Dimensions MDS 752 X A2 A View X k x 45 b 0,2 M e Z 0,1 A1 16 1 D Dimensions of Sub-Group B1 Amax bPmin bPmax enom HEmin HEmax LPmin Zmax 2 Weight 3 Package Body Material 4 Lead Material 5 Lead Finish 6 Lead Form 0,5 g Low Stress Epoxy FeNi-Alloy or Cu-Alloy solder plating Z-bends 1,73 0,35 0,49 1,27 5,80 6,30 0,40 0,55 Dimensions of Sub-Group C1 Amin A1min A1max A2min A2max cmin cmax Dmin* Dmax* Emin* Emax* kmin qmin qmax 1,55 0,127 0,25 1,40 1,55 0,19 0,25 9,80 9,98 3,80 4,00 0,25 0 8 * without mold-flash Zentrum Mikroelektronik Dresden AG Editor: signed Schoder Check: signed Marx Date: 30.03.1998 Quality: signed Lorenz Doc-No. QS-000752-HD-01 HE E c LP G |
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